Mehmet Dokmeci
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Micro sensors and micro actuators, micro/nano fabracation, packaging, Biomeds. | ||
Biography
Mehmet R. Dokmeci received the B.S. (with distinction) and the M.S. degrees from the University of Minnesota, Minneapolis and the Ph.D. degree from the University of Michigan, Ann Arbor, all in electrical engineering. His dissertation was on hermetic encapsulation of implantable microsystems for chronic use in living systems.
In Fall 2004, he joined the Electrical and Computer Engineering Department, Northeastern University as an Assistant Professor. Previously, he was an Assistant Research Scientist in the Electrical Engineering and Computer Science Department at the University of Michigan, Ann Arbor, where he developed a wafer level vacuum packaging technology based on Pb-Sn solders. He has 3.5 years of industrial experience at Corning-Intellisense Corporation, Wilmington, MA developing MEMS-based products for the telecommunications and life sciences industries. His research interests are concentrated in all areas of micro and nanofabrication and their applications to biomedical and optical devices, hermetic and vacuum packaging, humidity sensing and implantable biosensors. He has 29 technical publications in these areas. Dr. Dokmeci is a member of IEEE, MRS and HKN.